If you were really desperate, you'd sacrafice a few boards. Remove all components from one board, scan the top and bottom layers, grid them off, scan the lext layers, grind them off, scan the next layers, until no more layers. You can get a reasonably facsimile tht way. problem then comes the components. Can you still get them? If not, then skip step 1 completely as it's a waste of time. Even if you can, are they still sellable as a product. If not, then skip step 1 again for the same reason.
Considering what's involved, start over from scratch. It's easier and cheaper, and you'll know you're getting a product you can get parts for and sell to ROHS countries. Probably have a better product as well. Try to give me a UGM slot on it and I'll be happy!