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Author Topic: IBM looks for third party PowerPC mobo partners  (Read 6169 times)

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Offline downix

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Re: IBM looks for third party PowerPC mobo partners
« on: March 23, 2004, 02:10:32 PM »
@asian1

Why would IBM blame Winbond for the failed chipset when it was Mai that failed to deliver the chipset?

Unlike you, I did follow POP when it was happening, and I fully remember the lack of the Mentor Arc Inc (Mai) Aureate-GX northbridge was the area of failure.  The 1 Winbond chip on the reference design ships to this day, even if it is now hopelessly obsolete.
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Offline downix

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Re: IBM looks for third party PowerPC mobo partners
« Reply #1 on: March 23, 2004, 04:52:51 PM »
@asian1

That's quite interesting, as I've not had any issues getting winbond chips.  Also, as it was the southbridge, it is not as if they were locked-in as you are with a northbridge.  VIA and SIS still make PCI based southbridges, and as I've found, you can make a southbridge using OSS cores found on opencores.org without breaking the bank on a CPLD.
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