Surface mount soldering is *ALOT* more difficult than Through Hole Soldering (Which I can do).
SM soldering not nearly as difficult as you think. In fact it usually takes less time to get reasonable at it. One common misconception is that you need special tools. BGA aside, all you need is a reasonable temperature controlled soldering iron. Good quality solder with a reasonably aggressive flux or a standalone flux. You don't need a fine point tip. In fact chisel tips are the most versatile.
Small components like Rs and Cs you just put a little solder on one pad. Then place the part on the pad using tweezers while heating the pad. Then solder the other side, and then come back and add a little more solder to the original pad.
The process is much quicker and easier than the though hole equivalent. And the results I have seen from beginners is better than that of Trough Hole.
When doing a fine pitch IC a big tip works the best. Instead of individually soldering each pin you drag a large amount of solder across the pins with the board held at an angle. Solder likes to stick together and likes to follow the heat. This approach is a bit messy but gives excellent joints roughly equivalent to a wave soldered board. I haven't seen this method written up too often. I can give more precise details if anyone is interested. I have taught a few people this method and most of them got a reasonable result on the first attempt (with the aid of solder wick for the last couple of pins).
