trekiej wrote:
Is making multilayer boards a matter or sandwiching two boards together with an insulator in between?
Commercially produced multilayer boards are done this way. There are copper traces on insulated sheets, which are fused together. Various materials are used. Something like fiber glass can be used for this.
Home made dual layer boards can be done from double sided blank copper boards. It is quite tricky though.
One needs to be able to pass signals between the layers of the boards. Vias are the normal way to do this, but you may be able to get away with running wires around the edge of the board (not a great solution, for various reasons).
Using vias requires one to have the layouts for each side of the board to be very well aligned. Doing this by hand, probably requires quite large pads to be used for vias, with a generous amount of clearance around the pads, to allow for a little error.
A via can be made by drilling a hole through the board, and inserting a solid pin through, which is soldered to pads on each side.
The trick is to have the layout patterns aligned well to start with. I achieved this by ironing on my top layer first, then drilling a few holes, then use these holes to align the transfer for the bottom layer. You need to user a transparent toner transfer, or a transparent photolithographic sheet.
Generally, if you are doing double sided boards, then one would be using mostly surface mount components. Having some through hole components is OK, but if there are too many, then one side of the board will be lost to holes and pads.
Home made boards usually won't have very narrow traces, and quite generous clearance, which makes some surface mount packages unavailable.
Good luck, and have fun.
P.S. All the info you need is available online. Make sure you understand the safety issues, though.