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Author Topic: IBM opens new factory using 300mm wafers  (Read 3724 times)

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Offline Blitter

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Re: IBM opens new factory using 300mm wafers
« on: August 01, 2002, 11:51:12 AM »
Personally I would rather they concentrate their efforts on updating the PPC frontside bus and creating better reference designs for the north and south bridge.  I for one would love to see a company make reference designs the companies could make chipset's, cpu's, and memory that all ran at the same frequency.  There was a short periosd in time when this did occur.  But ithas long since vanished.  get rid of the bottle necks and bring on Solid-State drives!

Blitter
\\"What the hell am I looking at? When does this happen in the movie?\\"
- Dark Helmet
 

Offline Blitter

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Re: IBM opens new factory using 300mm wafers
« Reply #1 on: August 01, 2002, 12:55:15 PM »
@Valen

Temperature... not exactley... The chipset and RAM manufacturers are still using .18+ micron processes to make ram and chipsets.  there is still a lot of improvements that can be made in just changing the manufacturing process.  A drop in micron based processing means large Mhz/Ghz gains and not cost in temperature.  The closer you place the transitors to each other the less the friction the elctiricity causes.  Which allows you to up the voltage/wave frequency.

That's a very lamens explination, but I'm tired and I'm going to bed.  :-P

'night,

Blitter
\\"What the hell am I looking at? When does this happen in the movie?\\"
- Dark Helmet