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It depends on the job and the component. For surface mount caps I use a hot air desoldering station. For SIMM sockets I prefer to use a handheld desoldering pump but sometimes use a vacuum desoldering station. I also do that for through hole components. Surface chips are all removed with hot air. Through hole all with vacuum desoldering station so it is quick.I do have a set of Hakko desoldering tweezers, but I dont like to use them. Its to easy to kill a solder pad with those things, so I prefer to just break out the hot air unless its for something fast like one part.Thanks for the compliment. I am trying hard to save as many as I can and make sure its done right for a fair price!!