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Author Topic: IBM looks for third party PowerPC mobo partners  (Read 5656 times)

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Offline asian1

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Re: IBM looks for third party PowerPC mobo partners
« on: March 23, 2004, 12:19:21 PM »
Hello
This remind me of failed POP project (1999)
IBM blame Winbond (Taiwan) for failed chipset.
The POP project want to get the failed chipset design but IBM refused.
IBM try to force the POP project to use expensive, slow IBM chipsets.
After the failed OS/2 for PowerPC, IBM gave up on inexpensive PowerPC for mass.
In PC world, unless you can produce 10 millions motherboards, you are NOTHING.
Is there any plan by IBM to port AIX to the new PowerPC boards?
Will SCO try to stop the IBM Linux PowerPC project?
 

Offline asian1

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Re: IBM looks for third party PowerPC mobo partners
« Reply #1 on: March 23, 2004, 04:34:00 PM »
http://www.openppc.org/components.html

Hi
The POP board use Mentor/MAI northbridge and Winbond southbridge. According to the former leader of the project, the main problem was winbond. Anyway why IBM kept the design of chipset and refused to give it to the group?
Will IBM use their own chipset for the new PowerPC boards or other vendors?
Thx.