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Amiga computer related discussion => Amiga Hardware Issues and discussion => Topic started by: delshay on May 05, 2008, 09:23:53 AM
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iv found a photo of someone replacing a 603e with a 275Mhz PPC processor on the Blizzard PPC card.
is it possible to replace it with say 604e or a 640?
will a flash upgrade be needed if possible the above processors can be fitted.
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is it possible to replace it with say 604e or a 640?
No.
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You can only upgrade to a 603e CPU with 270MHZ.
But the reballing is very expensive, and you have a great risk.
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err never seen a 270Mhz 603e,only 240 or lower,250,275 & 300Mhz
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Sorry, it´s 275MHZ CPU.
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You can only upgrade to a 603e CPU with 270MHZ. *275Mhz*
cant a 300Mhz ppc be fitted?
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Hi,
someone got a modified BPPC with a true 300MHz on the GREX Yahoo!Group. And he succesfully clocked it a bit highier.
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cant a 300Mhz ppc be fitted?
Its just a matter of where to get such a cpu. I have a bunch of 275 MHz cpus but they are all soldered on a cpu board.
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iv been looking at the 603e manual,if its possible to fit, it may be possible to have 75Mhz bus speed or better still 83.3 Mhz bus speed with the CPU running at 300Mhz plus.
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How much performance do you expect to gain from 240 - 300MHz?
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pyrre wrote:
How much performance do you expect to gain from 240 - 300MHz?
Perhaps he just needs a warmer Amiga :-D
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its not all about how fast the processor can be clocked,its about *bus* speed which may be possible on Blizzard PPC @83.3Mhz ( with precharge all set to off in the Blizzard PPC menu ).
275Mhz & 300Mhz 603e processors has 75Mhz bus speed.
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**Blizzard PPC 040 to 060 upgrade important notes**.
this is the wrong forum but it applies to the Blizzard PPC.
iv bought three broken Blizzard ppc ( now all working ) and it seem some of you are trying to upgrading the card incorrectly.
TIPS:
when soldering/de-soldering do not push to hard on the board contacts.
iv also found very small bits of solder on the controller microchips ( be careful ).
when all solder is removed do not force remove processor/socket.
its also not a very good idea to insert a desoldered CPU back into a CPU socket.
iv also found blown components.
** VERY IMPORTANT **
IF YOU DO NOT KNOW WHAT YOU ARE DOING DONT RISK IT.
when soldering in new processor/socket ** DO NOT ** let to much solder roll back to the component,there are other tracks on the other side.
there is a possibility of contact with other track,and u may have to remove the whole component to remove solder on the other side of the component.
**ALL MODIFCATION AT YOUR OWN RISK**
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here comes ACube Systems excellent.
http://www.acube-systems.biz/eng/news.php?id=28
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what is Ralph Schmidt doing now and how do i contact him?
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you can even change the ppc with an 740 (G3 without cache).
its the only chip that its fully bus, pin and voltage compatible with 603.
its core is almost the same with some minor optimization, as I have found you don't need a new firmware for that cpu.
But the problem is the bga soldering..
and really.... IS IT WORTH THE RISK??
I have destroyed one bppc with that experiment, althought it managed to boot, I think the instability was because of bga soldering technique that it might have destroyed in some way the card and /or even the 740 chip because of excessive heat.
BGA soldering in a full populated card, is something almost not possible without some specialized (and I think way too expensive) tools. Even production lines doesn't have them, if something goes wrong they just throw the card with that bga chip on the bin.
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StormLord wrote:
you can even change the ppc with an 740 (G3 without cache).
its the only chip that its fully bus, pin and voltage compatible with 603.
its core is almost the same with some minor optimization, as I have found you don't need a new firmware for that cpu.
But the problem is the bga soldering..
and really.... IS IT WORTH THE RISK??
I have destroyed one bppc with that experiment, althought it managed to boot, I think the instability was because of bga soldering technique that it might have destroyed in some way the card and /or even the 740 chip because of excessive heat.
BGA soldering in a full populated card, is something almost not possible without some specialized (and I think way too expensive) tools. Even production lines doesn't have them, if something goes wrong they just throw the card with that bga chip on the bin.
FREESCALE no longer do a 740 its now 745.
also how did you solder the CPU?
what did you do with the EXTRA signals? :-)
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i've pretty much given up with PPC stuff on 3.1/5/9 . its friggin useless. patch this, install that, copy the other. specific versions of warpup/3d for specific applications. and ... oh look, another PPC exception...
it seems to me the only usefull thing a BlizzPPC has above a Blizz1240/60 is the miniPCI connector for the graphics card.
why was it so easy with a cyberstormPPC, in yet blizzardPPC is a freaking pain in the arse? :crazy:
i don't know why anyone would want to overclock something of limited usefullness anyway. "hey i got this rare card that i've paid a shed load of cash for, can't replace or get repaired, and i'm going to have it play russian roulett with a soldering iron" :roll: :lol:
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delshay wrote:
FREESCALE no longer do a 740 its now 745.
also how did you solder the CPU?
what did you do with the EXTRA signals? :-)
EXTRA signals?? what do you mean by that? if you study the data sheets of both processors you will see that there are not differences in signaling. exept PIDs that are also on the same pins. if I remember correctly (this project was MANY years ago) 603 pids could program the multiplier till 6x and 740 till 10x. even though for the first 12 stages (6x) they used the same codes. now that Im trying to remember 603 could do 1x but 740 started at 3x. but don't count my word for sure, there 've been many years since. Data sheets are always your friend!
;-)
As for soldering... I solder it in a panasonic service store, NO BGA rework tools except the 2 hot air-guns with programable degrees (one upper-side one downside). We made 2 aluminum frames to not allow massive hot air escape to other components. I desolder all components from downside of the board to where 603 is placed. upper frame was a like U because we used an infrared camera to verify on the process that at LEAST one line of balls were melted and soldered.
For desoldering nothing deficullt because I used a card that had an PLCC 603 soldered so it was an easy task.
EDIT:
DCE cards are very bad quality that with only a percentage more of heat, solder points are pop-up from the board. DONT MESS WITH IT BY ANY REASON!!!
From the other hand P5 boards are more tolerate to heat abuse!
;-)